InterConnect is participating in SP 2022 in two paper sessions dedicated to Smart Buildings and User Engagement. In this event, the consortium will be represented by David Rua and Fábio Coelho (INESC TEC), Laura Daniele (TNO), Milenko Tosic (Vizlore), Josef Baumeister (Bosch Siemens), and Jean-Philippe Pierre (ISEN Yncréa Méditerranée).